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US 6,583,447 B2Granted
Multiple LED chip package
AssigneeHarvatek Corporation
InventorsBily Wang, Bill Chang, Yann Lee
Life of this patent
Estimating the term…
Abstract
A surface-mount package for multiple LED chips is constructed by inscribing a groove in an insulating substrate. The LED chips are mounted in the groove and the leads are connected to metal plates, which wrap around the substrate to provide bottom contacts for surface-mounting.
Claims8
A package for optoelectronic device, comprising:
- an insulating substrate;
- a groove cut in said insulating substrate;
- at least a first metal plate lining the bottom of said groove, extending over a first shoulder of said groove, and wrapping around said substrate to form a first bottom contact for surface mounting to a motherboard;
- more than one optoelectronic chip within the groove, having at least one electrode connected with said metal plate, and
- at least a second metal plate connected with a second electrode of said chip, extending over a second shoulder of said groove, and wrapping around said substrate to form a second bottom contact for surface mounting to said motherboard.
2 more elements
Dependencies are inferred from the claim text.