Semiconductor parts and semiconductor mounting apparatus
AssigneeFujitsu Limited
InventorTakayuki Watanabe
Life of this patent
Estimating the term…
Abstract
To provide a package structure for securing a satisfactory optical coupling between an optical device arranged beforehand on a printed board and an optical device newly mounted on the particular printed board. Positioning LDs 41a and 41b are arranged on a printed board 1. A sensing PD 42a for receiving the optical signal emitted from the positioning LD 41a and a sensing PD 42b for receiving the optical signal emitted from the positioning LD 41b are arranged in an OEIC package 11 mounted on the printed board.
Claims11
A semiconductor part mounted on a printed board on which an optical device is arranged, characterized by comprising:
- light-emitting elements for outputting an optical signal to said optical device;
- and
- photo-detectors for receiving the optical signal emitted by said light-emitting elements, through said optical device.
A semiconductor part mounted on a printed board on which photoelectric elements are arranged,
- characterized by comprising an optical device for communicating with said photoelectric elements using an optical signal.
A printed board on which a semiconductor part including photoelectric elements is mounted,
- characterized in that an optical transmission path is arranged for receiving an optical signal transmitted by said semiconductor part and returning said optical signal to said semiconductor part.
A printed board on which a semiconductor part including an optical device is mounted,
- characterized by comprising photoelectric elements for optically communicating with said optical device.
A printed board unit characterized by comprising:
- a board having a surface on which parts are mounted;
- a semiconductor part mounted on said board and including light-emitting elements and photo-detectors;
- and
- an optical transmission path arranged on said board and having an end thereof optically coupled to the light-emitting elements of said semiconductor part and the other end thereof optically coupled to the photo-detectors of said semiconductor part.
A printed board unit characterized by comprising:
- a board on which an electronic part is mounted;
- a semiconductor part mounted on said board and including an optical device;
- and
- photoelectric elements arranged on said board and optically coupled to said semiconductor part.
Dependencies are inferred from the claim text.