High thermal efficiency, small form-factor packages including thermally insulative cavities, and transfer molded variants

Abstract

An optical component package, having an insulative buffer placed against the component, enclosing a first insulative cavity against a temperature-sensitive portion of the component. An outer package provides additional insulation for the component. The buffer may be formed of a soft insulative material, and pressed against the component by an inner surface of the outer package. For the PLC embodiments disclosed, the buffer is planar and includes a frame projecting from its perimeter toward the component to form the cavity. A heater may be positioned proximate the optical component to control its temperature, in which case a second buffer may be placed against the heater, enclosing a second insulative cavity against the heater, aligned with the temperature-sensitive portion of the component. The buffers and insulative cavities of the present invention provide important insulation for optical areas requiring precise temperature control for proper operation.

Dependencies are inferred from the claim text.