Method for soldering surface mount components to a substrate using a laser
AssigneeVisteon Global Technologies, Inc.
InventorsPeter Joseph Sinkunas, Zhong-You (Joe) Shi, Jay D. Baker
Life of this patent
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Abstract
A method for reflowing a solder dispersed between a plurality electrical circuit conductor pads attached to a flexible substrate and at least one electronic component using a laser is disclosed. The method includes aligning the plurality of electric circuit conductor pads along a common axis, placing the at least one electronic component having a light colored surface side on a pair of the electrical circuit conductor pads wherein the light colored surface faces the laser, and sweeping the laser across a plurality of electronic components and conductor pads to reflow the solder without damaging the substrate.
Claims18
A method for reflowing a solder dispersed between a plurality electrical circuit conductor pads attached to a flexible substrate and at least one electronic component using a laser, the method comprising:
- aligning the plurality of electric circuit conductor pads along a common axis;
- placing the at least one electronic component having a light colored surface side on a pair of the electrical circuit conductor pads wherein the light colored surface faces the laser;
- and
- sweeping the laser across a plurality of electronic components and conductor pads to reflow the solder without damaging the substrate.
A method for reflowing a solder dispersed between a plurality electrical circuit conductor pads attached to a flexible substrate and at least one electronic component using a laser, the method comprising:
- aligning the plurality of electric circuit conductor pads along a common axis;
- placing the at least one electronic component having a light colored surface side on a pair of the electrical circuit conductor pads wherein the light colored surface faces the laser;
- raising a temperature of the substrate;
- and
- sweeping the laser across a plurality of electronic components and conductor pads to reflow the solder without damaging the substrate.
A method for reflowing a solder dispersed between a plurality electrical circuit conductor pads attached to a flexible substrate and at least one electronic component using a laser, the method comprising:
- aligning the plurality of electric circuit conductor pads along a common axis;
- placing the at least one electronic component having a light colored surface side on a pair of the electrical circuit conductor pads wherein the light colored surface faces the laser;
- raising a temperature of the substrate;
- and
- sweeping the laser, having a laser beam spot having a length and width sufficient to cover the electrical circuit components, across a plurality of electronic components and conductor pads to reflow the solder without damaging the substrate.
Dependencies are inferred from the claim text.