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US 6,583,383 B2Granted
Method and apparatus for cutting a semiconductor wafer
AssigneeShinko Electric Industries Co., Ltd.
InventorsMitsutoshi Higashi, Hideaki Sakaguchi
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AssigneeShinko Electric Industries Co., Ltd.
InventorsMitsutoshi Higashi, Hideaki Sakaguchi
Estimating the term…
A method for cutting a semiconductor wafer is provided. A mount tape is adhered to a back surface of the semiconductor wafer. The mount tape comprises a resin base and a mesh-like member made of a material harder than that of the resin base and embedded in the resin base. A beam-like liquid jet is ejected toward a front surface of the semiconductor wafer and, simultaneously, a laser beam is transmitted axially through said beam-like liquid jet, so that the semiconductor wafer is cut into individual pieces, by said laser beam, together with the resin base of the mount tape, while the mesh-like member is not cut, but remains in its connected state.
A method for cutting a semiconductor wafer, said method comprising the following steps of:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
Working by laser beam, e.g. welding, cutting or boring: using absorbing layers on the workpiece, e.g. for marking or protecting purposes
Using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor: the fluid stream containing a liquid
Cutting or separating of wafers, substrates or parts of devices
Soldering or unsoldering
Term ended 24 Jul 2021 (estimated)
1. Field of the Invention
The present invention relates to a method and an apparatus for cutting a semiconductor wafer and, more particularly to a method and an apparatus for cutting a semiconductor wafer, adhered to a mount tape, into individual pieces by a cutter.
2. Description of the Related Art
FIG. 1 is a sectional view of a wafer adhered to a mount tape used in the present invention;
FIG. 2 is a schematic view of a laser cutter used in the present invention;
FIGS. 3 and 4 are an enlarged partial sectional view and an overall sectional view, respectively, of the wafer and the mount tape cut with the laser cutter shown in FIG. 2;
As shown in FIG. 1, a mount tape 10 used in the present invention is mainly made of polyimide resin 16 and has a mesh-like member 18 formed of a material harder than the resin. The mesh-like member shown in FIG. 1 is a glass cloth 18 formed of glass filaments. The glass cloth 18 is woven with glass filaments in a plain weave. Such a glass cloth 18 is embedded horizontally all over the mount tape 10 and generally at a central position in the thickness direction thereof.
As shown in FIG. 1, a back surface of a wafer 12 is adhered via an adhesive layer 14 to one surface of the mount tape 10 carrying the glass cloth 18. The adhesive layer 14 is composed of an ultraviolet-curing resin.
While the glass cloth 18 exists all over the mount tape 10 in the embodiment shown in FIG. 1, it may be provided solely in an area where the wafer 12 is to be adhered.