Conductive pads layout for BGA packaging structure

A conductive pad layout for ball grid array (BGA) packaging structure implemented on a circuit substrate that includes a front surface where a chip is mounted, the conductive pad layout comprising:

• a contact pad defined on the front surface of the circuit substrate and transmitting a critical signal;
• an anti-interference contact pad defined adjacent to the contact pad and connected to a reference voltage;
• a first bonding wire connecting the chip to the contact pad;
• a second bonding wire connecting the chip to the anti-interference contact pad, thereby preventing undesirable interference with the first bonding wire;
• a ball pad defined on a bottom surface of the circuit substrate that is opposite to the front surface;
• and
• a dummy ball pad defined adjacent to the ball pad as a reference voltage connection and not connected to any vias.

A conductive pad layout for ball grid array (BGA) packaging structure implemented on a circuit substrate that includes a front surface where a chip is mounted, the conductive pad layout comprising:

• a first contact pad defined on the front surface of the circuit substrate;
• a first bonding wire connecting the chip to the first contact pad;
• a second contact pad defined on the front surface of the circuit substrate, the second contact pad being closer to the chip than the first contact pad and transmitting a critical signal;
• a second bonding wire connecting the chip to the second contact pad, the second bonding wire being shorter than the first bonding wire;
• an anti-interference contact pad defined at a location on the front surface of the circuit substrate that is adjacent to the second contact pad, wherein the anti-interference contact pad is further connected to a reference voltage and the chip connects the anti-interference contact pad via a third bonding wire of approximately the same length as the second bonding wire;
• a first ball pad defined on a bottom surface of the circuit substrate that is opposite to the front surface, the first ball pad being connected to the second contact pad by means of a first via defined through the circuit substrate;
• and
• a dummy ball pad defined adjacent to the first ball pad, the dummy ball pad being not connected to any via and defined as ground connection.

A conductive pad layout for ball grid array (BGA) packaging structure implemented on a circuit substrate that includes a front surface where a chip is mounted, the conductive pad layout comprising:

• a first contact pad defined on the front surface of the circuit substrate;
• a first bonding wire connecting the chip to the first contact pad;
• a second contact pad defined on the front surface of the circuit substrate, the second contact pad being closer to the chip than the first contact pad and transmitting a critical signal;
• a first ball pad defined on a bottom surface of the circuit substrate that is opposite to the front surface;
• a first via defined through the circuit substrate to connect the first ball pad;
• a first conductor trace connecting the second contact pad to the first via;
• a dummy ball pad defined adjacent to the first ball pad, the dummy ball pad being not connected to any via;
• and
• a second bonding wire connecting the chip to the second contact pad, the second bonding wire being shorter than the first bonding wire so that interference there between is thereby prevented.