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AssigneeSony Chemicals Corp.
InventorsHideyuki Kurita, Masanao Watanabe, Masayuki Nakamura, Mitsuhiro Fukuda, Hiroyuki Usui
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The present invention pertains to a multilayer flexible wiring board. The multilayer flexible wiring board including first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiring layer, and a bump connected to the surface of the second wiring layer, wherein the resin film is adapted to form an opening when the bump to force into the resin film and an ultrasonic wave is applied to the bump and the bump is left in the opening to electrically connect the top of the bump to the first wiring layer.
A multilayer flexible wiring board comprising first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiring layer, and a bump connected to said second wiring layer and protruding from said surface of said second wiring layer, wherein said resin film is malleable to form an opening without application of heat, the opening is formed when said bump is forced into said resin film and an ultrasonic wave is applied to said bump and said bump is left in said opening to electrically connect the top of said bump to said first wiring layer.
A multilayer flexible wiring board comprising first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiring layer, and a plurality of bumps connected to said surface of said second wiring layer, wherein said resin film is malleable to form a plurality of openings without application of heat, the plurality of openings are formed when said plurality of bumps are forced into said resin film and an ultrasonic wave is applied to said plurality of bumps, wherein each of said bumps is located in each of said openings to electrically connect the top of said each bump to said first wiring layer.
Dependencies are inferred from the claim text.