Method of reforming reformable members of an electronic package and the resultant electronic package
AssigneeInternational Business Machines Corporation
InventorDavid J. Alcoe
Life of this patent
Estimating the term…
Abstract
An electronic package includes a substrate having a contact pad thereon, a reformable member such as a solder ball positioned on the contact pad, and an elastic member positioned around the reformable member. The elastic member exerts a girdling force on the reformable member so that when the reformable member is softened, the elastic member elongates the reformable member. This elongation accommodates thermal and other stresses between the foregoing substrate and another substrate joined at the free end of the reformable member. An apparatus is also provided for positioning the elastic member on and around the reformable member.
Claims27
An electronic package comprising:
- a substrate having a contact pad thereon;
- a reformable member having at least one side portion and a bottom portion positioned on said contact pad, said bottom portion adapte or being positioned on and electrically coupled to an external conductor;
- and
- an elastic member positioned substantially around only said at least one side portion and in contact with said reformable member, said elastic member providing a girdling pressure on said reformable member.
Dependencies are inferred from the claim text.