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US 6,583,201 B2Granted
Conductive materials with electrical stability for use in electronics devices
AssigneeNational Starch and Chemical Investment Holding Corporation
InventorsChih-Min Cheng, Gerry Fredrickson, Girish Hanchinamani
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Abstract
An composition with improved electrical stability for use in microelectronic applications comprises a polymeric resin, a conductive filler, a curing agent, optionally either a reactive or a nonreactive diluent and a corrosion inhibitor to provide the electrical stability.
Claims24
A composition for use in microelectronic devices comprising
- (a) a polymeric resin,
- (b) a conductive filler,
- (c) a corrosion inhibitor,
- (d) a curing agent or catalyst,
- (e) an adhesion promoter, and
- (f) optionally, a reactive or a nonreactive diluent
- wherein the corrosion inhibitor is selected from the group consisting of 6-hydroxyquinoline, 2-hydroxyquinoline or piperidene.
4 more elements
A composition for use in microelectronic devices comprising
- (a) a polymeric resin,
- (b) a conductive filler,
- (c) a corrosion inhibitor,
- (d) a curing agent or catalyst, and
- (e) an adhesion promoter,
- (f) 8-hydroxyquinoline, and
- (g) optionally, a reactive or a nonreactive diluent,
- wherein the corrosion inhibitor is selected from the group consisting of N-Hydroxysuccinimide, piperidene or mixtures thereof.
5 more elements
Dependencies are inferred from the claim text.