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AssigneeHitachi Chemical Company, Ltd.
InventorsKuniaki Sato, Hiroaki Hirakura, Toshihiko Ito, Takao Hirayama, Toshizumi Yoshino
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A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can gives a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.
A photo curable resin composition, which comprises (A) an epoxy resin modified by a vinyl group-containing monocarboxylic acid, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, wherein the elastomer (B) is contained in an amount of 2 to 50 parts by weight per 100 parts by weight of the modified epoxy resin (A), and wherein the elastomer (B) is at least one member selected from the group consisting of styrene-based elastomers, olefinic elastomers, urethane-based elastomers, polyester-based elastomers, polyamide-based elastomers, acrylic elastomers, and silicone-based elastomers.
A photo curable resin composition comprising (A) an epoxy resin modified by a vinyl group-containing monocarboxylic acid, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, wherein the elastomer (B) is contained in an amount of 2 to 50 parts by weight per 100 parts by weight of the modified epoxy resin (A), and wherein the elastomer (B) is a rubber-modified epoxy resin.
A photo curable resin composition, which comprises a polymer alloy (A) an epoxy resin modified by a vinyl group-containing monocarboxylic acid, and (B) an elastomer, said composition providing cured film having an elastic modulus of 1 to 100 MPa in dynamic visco-elasticity measurement in a region of 200° to 220° C., wherein the elastomer (B) is at least one member selected from the group consisting of styrene-based elastomers, olefinic elastomers, urethane-based elastomers, polyester-based elastomers, polyamide-based elastomers, acrylic elastomers, and silicone-based elastomers.
A photo curable resin composition, which comprises (A) an epoxy resin modified by a vinyl group-containing monocarboxylic acid, and (B) an elastomer, wherein the elastomer (B) is contained in an amount of 2 to 50 parts by weight per 100 parts by weight of the modified epoxy resin (A), and wherein the elastomer (B) is at least one member selected from the group consisting of styrene-based elastomers, olefinic elastomers, urethane-based elastomers, polyester-based elastomers, polyamide-based elastomers, acrylic elastomers, and silicone-based elastomers.
A photo curable resin composition, which comprises (A) an epoxy resin modified by a vinyl group-containing monocarboxylic acid, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, said resin composition providing a cured film polymer alloy having an elastic modulus of 1 to 100 MPa in dynamic visco-elasticity measurement in a region or 200° to 220° C., wherein (A) and (B) form a polymer alloy wherein the elastomer (B) is contained in an amount of 2 to 50 parts by weight per 100 parts by weight of the modified epoxy resin (A), and wherein said epoxy resin is cresol novolak epoxy resin modified with acrylic acid and further with tetrahydrophthalic anhydride, and the elastomer is butadiene-acrylonitrile copolymer modified with carboxyl groups at both ends.
Dependencies are inferred from the claim text.