Drying process for woven glass fabric intended for use as a reinforcing laminate in printed circuit boards
AssigneeBGF Industries, Inc.
InventorsMichael I. Bryant, Charles E. Jones
Life of this patent
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Abstract
A process for the drying of woven glass fabric to be used in a reinforcing laminate in sensitive electronic equipment is disclosed. The process adopts a drying technique of utilizing dielectric or radio frequency heating which results in a cleaner product.
Claims3
A woven reinforcing fiberglass fabric substrate for printed circuit boards wherein said reinforcing fabric is dielectrically dried after the application of an aqueous finish solution containing a silane coupling agent, resulting in a lower level of contaminating particles therein than is the case when the same woven fiberglass fabric is hot air dried.
A printed circuit board comprising multi-layer composites of thermosetting polymers and reinforcing fabric substrate, wherein said fabric substrate is a woven fiberglass fabric dielectrically dried after the application of an aqueous based finish solution containing a silane coupling agent.
Dependencies are inferred from the claim text.