Ultrasonic spray coating of liquid precursor for low K dielectric coatings
AssigneeApplied Materials, Inc.
InventorsTimothy Weidman, Yunfeng Lu, Michael P Nault, Michael Barnes, Farhad Moghadam
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Abstract
A process for forming a extremely low dielectric constant film over a substrate. The process includes coating a substrate with a solution comprising a soluble source of silicon oxide, water, a solvent, a surfactant and a catalyst using an ultrasonic spray nozzle. The coated substrate is then subsequently treated to harden the solution into an extremely low dielectric constant film.
Claims14
A process for forming an extremely low dielectric constant film over a substrate, said process comprising:
- coating said substrate with a solution comprising a soluble source of silicon oxide, water, a solvent, a surfactant and a catalyst using an ultrasonic spray nozzle, wherein said solution is delivered to said ultrasonic spray nozzle from at least first and second separate sources that are combined at or immediately prior to said ultrasonic spray nozzle;
- and
- treating said coated substrate to harden the solution into said extremely low dielectric constant film.
A process for forming an extremely low dielectric constant film over a substrate, said process comprising:
- coating said substrate with a solution comprising a soluble source of silicon oxide, water, a solvent, a surfactant and a catalyst using an ultrasonic spray nozzle in a vacuum chamber having an exhaust port and a vacuum pump operatively coupled to the exhaust port to enable the creation of a reduced pressure atmosphere within the chamber;
- and
- treating said coated substrate to harden the solution into said extremely low dielectric constant film.
Dependencies are inferred from the claim text.