Method of making a pillar in a laminated structure for a semiconductor chip assembly

A method of making a semiconductor chip assembly, comprising:

• providing a semiconductor chip that includes a conductive pad;
• providing a laminated structure that includes a conductive trace, an insulative base and a metal base, wherein the conductive trace includes a routing line and a pillar, the metal base and the routing line are disposed on opposite sides of the insulative base, and the pillar contacts the routing line and extends through the insulative base and into the metal base;
• then
• disposing an insulative adhesive between the chip and the laminated structure, thereby mechanically attaching the chip to the laminated structure such that the metal base is disposed on a side of the insulative base that faces away from the chip and the routing line is disposed on a side of the insulative base that faces towards the chip;
• then
• removing a portion of the metal base that contacts the pillar;
• and
• forming a connection joint that contacts and electrically connects the conductive trace and the pad.

A method of making a semiconductor chip assembly, comprising:

• providing a laminated structure that includes a conductive trace, an insulative base and a metal base, wherein the conductive trace includes a routing line and a pillar, the metal base and the routing line are disposed on opposite sides of the insulative base, and the pillar contacts the routing line and extends through the insulative base and into the metal base;
• then
• disposing an insulative adhesive between a chip and the laminated structure, thereby mechanically attaching the chip to the laminated structure, wherein the chip includes a pad, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip and extends within and outside a periphery of the chip, and the pillar is disposed outside the periphery of the chip and extends through the insulative base;
• removing a portion of the metal base that contacts the pillar;
• and
• forming a connection joint that contacts and electrically connects the routing line and the pad.

A method of making a semiconductor chip assembly, comprising the following steps in the sequence set forth:

• providing a laminated structure that includes a conductive trace, an insulative base and a metal base, wherein the conductive trace includes a routing line and a pillar, the metal base and the routing line are disposed on opposite sides of the insulative base, and the pillar contacts the routing line and extends through the insulative base and into the metal base;
• disposing an insulative adhesive between a chip and the laminated structure, thereby mechanically attaching the chip to the laminated structure, wherein the chip includes a pad, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip and extends within and outside a periphery of the chip, and the pillar is disposed outside the periphery of the chip and extends through the insulative base;
• removing portions of the metal base that overlap the pad and contact the pillar;
• forming a through-hole that extends through the insulative base and the adhesive and exposes the routing line and the pad;
• and
• forming a connection joint that contacts and electrically connects the routing line and the pad.

A method of making a semiconductor chip assembly, comprising:

• providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base;
• forming a via in the laminated structure that extends through the insulative base and into the metal base and the metal layer;
• depositing a non-solidified material into the via;
• hardening the non-solidified material to form a pillar that fills the portion of the via that extends through the insulative base, at least partially fills the portion of the via that extends into the metal base and at least partially fills the portion of the via that extends into the metal layer;
• providing an etch mask on the metal layer, wherein the etch mask includes an opening that exposes a portion of the metal layer;
• applying an etch to the exposed portion of the metal layer through the opening in the etch mask, thereby forming a routing line from an unetched portion of the metal layer;
• then
• mechanically attaching a chip to the laminated structure using an insulative adhesive, wherein the chip includes a pad, a conductive trace includes the routing line and the pillar, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip, and the pillar contacts the routing line;
• removing a portion of the metal base that contacts the pillar, wherein the pillar extends beyond the insulative base in a direction away from the chip;
• and
• forming a connection joint that contacts and electrically connects the routing line and the pad.

A method of making a semiconductor chip assembly, comprising:

• providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base;
• forming a via in the laminated structure that extends through the insulative base and into the metal base and the metal layer;
• depositing a non-solidified material into the via;
• hardening the non-solidified material to form a pillar that fills the portion of the via that extends through the insulative base, at least partially fills the portion of the via that extends into the metal base and at least partially fills the portion of the via that extends into the metal layer;
• providing an etch mask on the metal layer, wherein the etch mask includes an opening that exposes a portion of the metal layer;
• applying an etch to the exposed portion of the metal layer through the opening in the etch mask, thereby forming a routing line from an unetched portion of the metal layer;
• and then, in the sequence set forth,
• mechanically attaching a chip to the laminated structure using an insulative adhesive, wherein the chip includes a pad, a conductive trace includes the routing line and the pillar, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip, the routing line overlaps the pad and extends within and outside a periphery of the chip, and the pillar contacts the routing line and is disposed outside the periphery of the chip;
• removing a first portion of the metal base that overlaps the pad and a second portion of the metal base that contacts the pillar, wherein the pillar extends beyond the insulative base in a direction away from the chip;
• forming a through-hole that extends through the insulative base and the adhesive and exposes the routing line and the pad;
• and
• forming a connection joint that contacts and electrically connects the routing line and the pad.

A method of making a semiconductor chip assembly, comprising:

• providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base;
• forming a via in the laminated structure that extends through the insulative base and reaches the metal base and the metal layer;
• forming a routing line from a first portion of the metal layer by selectively removing a second portion of the metal layer;
• forming a pillar in the via, wherein the pillar extends through the insulative base and contacts the metal base, the insulative base and the metal layer in the via;
• then
• mechanically attaching a chip to the laminated structure using an insulative adhesive, wherein the chip includes a pad, a conductive trace includes the routing line and the pillar, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip, and the pillar contacts the routing line;
• then
• removing a portion of the metal base that contacts the pillar;
• and
• forming a connection joint that contacts and electrically connects the routing line and the pad.

A method of making a semiconductor chip assembly, comprising:

• providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base;
• forming a via in the laminated structure that extends through the metal base, the insulative base and the metal layer;
• forming a conductive trace that includes a routing line and a pillar, wherein the routing line and the pillar are different materials, the routing line is formed from an unetched portion of the metal layer, and the pillar contacts the metal base, the insulative base and the routing line in the via, extends across the opposite sides of the insulative base, and extends into the metal base and the routing line;
• then
• mechanically attaching a chip to the laminated structure using an insulative adhesive, wherein the chip includes a pad, the metal base is disposed on a side of the insulative base that faces away from the chip, and the routing line is disposed on a side of the insulative base that faces towards the chip;
• removing a portion of the metal base that contacts the pillar, wherein the pillar includes an exposed protruding portion that extends beyond the insulative base in a direction away from the chip;
• and
• forming a connection joint that contacts and electrically connects the routing line and the pad.

A method of making a semiconductor chip assembly, comprising:

• providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base;
• forming a via in the laminated structure that extends through the metal base, the insulative base and the metal layer and has open opposing ends;
• providing a plug that seals the via at one end such that the via has a sealed end and an unsealed end;
• depositing an electrically conductive material into the via from the unsealed end while the plug provides the sealed end, wherein the electrically conductive material contacts the plug, the metal base, the insulative base and the metal layer in the via;
• removing the plug;
• forming a conductive trace that includes a routing line and a pillar, wherein the routing line is formed from an unetched portion of the metal layer, the pillar is formed from the electrically conductive material, and the pillar contacts the metal base, the insulative base and the routing line in the via, extends across the opposite sides of the insulative base, and extends into the metal base and the routing line;
• mechanically attaching a chip to the laminated structure using an insulative adhesive, wherein the chip includes a pad, the metal base is disposed on a side of the insulative base that faces away from the chip, and the routing line is disposed on a side of the insulative base that faces towards the chip;
• removing a portion of the metal base that contacts the pillar, wherein the pillar includes an exposed protruding portion that extends beyond the insulative base in a direction away from the chip;
• and
• forming a connection joint that contacts and electrically connects the routing line and the pad.

A method of making a semiconductor chip assembly, comprising:

• providing a semiconductor chip and a laminated structure, wherein the chip includes a conductive pad, the laminated structure includes a conductive trace, other conductive traces, an insulative base and a metal base, the conductive trace includes a routing line and a pillar, the other conductive traces include other routing lines and other pillars, the metal base and the routing line are disposed on opposite sides of the insulative base, the metal base and the other routing lines are disposed on opposite sides of the insulative base, the pillar contacts the routing line and extends through the insulative base and into the metal base, the other pillars contact the other routing lines and extend through the insulative base and into the metal base, and the metal base electrically connects the conductive trace to the other conductive traces;
• then
• removing a portion of the metal base, thereby electrically isolating the conductive trace from the other conductive traces;
• and
• forming a connection joint that contacts and electrically connects the conductive trace and the pad.

A method of making a semiconductor chip assembly, comprising:

• providing a semiconductor chip that includes a conductive pad;
• providing a laminated structure that includes a conductive trace, an insulative base and a metal base, wherein the conductive trace includes a routing line and a pillar, the metal base and the routing line are disposed on opposite sides of the insulative base, and the pillar contacts the routing line and extends through the insulative base and into the metal base;
• then
• disposing an adhesive between the chip and the laminated structure, thereby mechanically attaching the chip to the laminated structure such that the metal base is disposed on a side of the insulative base that faces away from the chip and the routing line is disposed on a side of the insulative base that faces towards the chip;
• then
• removing a portion of the metal base, thereby electrically isolating the pillar from other pillars that extend through the insulative base;
• and
• forming a connection joint that contacts and electrically connects the conductive trace and the pad.

A method of making a semiconductor chip assembly, comprising:

• providing a laminated structure that includes a conductive trace, an insulative base and a metal base, wherein the conductive trace includes a routing line and a pillar, the metal base and the routing line are disposed on opposite sides of the insulative base, and the pillar contacts the routing line and extends through the insulative base and into the metal base;
• then
• disposing an adhesive between a chip and the laminated structure, thereby mechanically attaching the chip to the laminated structure, wherein the chip includes a pad, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip and extends within and outside a periphery of the chip, and the pillar is disposed outside the periphery of the chip and extends through the insulative base;
• then
• removing a portion of the metal base that contacts the pillar, thereby electrically isolating the pillar from other pillars that extend through the insulative base;
• and
• forming a connection joint that contacts and electrically connects the routing line and the pad.

A method of making a semiconductor chip assembly, comprising:

• providing a laminated structure that includes a conductive trace, an insulative base and a metal base, wherein the conductive trace includes a routing line and a pillar, the metal base and the routing line are disposed on opposite sides of the insulative base, and the pillar contacts the routing line and extends through the insulative base and into the metal base;
• disposing an adhesive between a chip and the laminated structure, thereby mechanically attaching the chip to the laminated structure, wherein the chip includes a pad, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip and extends within and outside a periphery of the chip, and the pillar is disposed outside the periphery of the chip and extends through the insulative base;
• then
• removing portions of the metal base that contact the pillar and other pillars that extend through the insulative base, thereby electrically isolating the pillar from the other pillars;
• and
• forming a connection joint that contacts and electrically connects the routing line and the pad.

A method of making a semiconductor chip assembly, comprising:

• providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base;
• forming a via in the laminated structure that extends through the insulative base and into the metal base and the metal layer;
• depositing a non-solidified material into the via;
• hardening the non-solidified material to form a pillar that fills the portion of the via that extends through the insulative base, at least partially fills the portion of the via that extends into the metal base and at least partially fills the portion of the via that extends into the metal layer;
• providing an etch mask on the metal layer, wherein the etch mask includes an opening that exposes a portion of the metal layer;
• applying an etch to the exposed portion of the metal layer through the opening in the etch mask, thereby forming a routing line from an unetched portion of the metal layer;
• then
• mechanically attaching a chip to the laminated structure using an adhesive, wherein the chip includes a pad, a conductive trace includes the routing line and the pillar, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip, and the pillar contacts the routing line;
• then
• removing a portion of the metal base that contacts the pillar, thereby electrically isolating the pillar from other pillars that extend through the insulative base, wherein the pillar extends beyond the insulative base in a direction away from the chip;
• and
• forming a connection joint that contacts and electrically connects the routing line and the pad.

A method of making a semiconductor chip assembly, comprising:

• providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base;
• forming a via in the laminated structure that extends through the insulative base and into the metal base and the metal layer;
• depositing a non-solidified material into the via;
• hardening the non-solidified material to form a pillar that fills the portion of the via that extends through the insulative base, at least partially fills the portion of the via that extends into the metal base and at least partially fills the portion of the via that extends into the metal layer;
• providing an etch mask on the metal layer, wherein the etch mask includes an opening that exposes a portion of the metal layer;
• applying an etch to the exposed portion of the metal layer through the opening in the etch mask, thereby forming a routing line from an unetched portion of the metal layer;
• then
• mechanically attaching a chip to the laminated structure using an adhesive, wherein the chip includes a pad, a conductive trace includes the routing line and the pillar, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip, the routing line overlaps the pad and extends within and outside a periphery of the chip, and the pillar contacts the routing line and is disposed outside the periphery of the chip;
• then
• removing a first portion of the metal base that contacts the pillar and a second portion of the metal base that contacts other pillars that extend through the insulative base, thereby electrically isolating the pillar from the other pillars, wherein the pillar extends beyond the insulative base in a direction away from the chip;
• forming a through-hole that extends through the insulative base and the adhesive and exposes the routing line and the pad;
• and
• forming a connection joint that contacts and electrically connects the routing line and the pad.

A method of making a semiconductor chip assembly, comprising:

• providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base;
• forming a via in the laminated structure that extends through the insulative base and reaches the metal base and the metal layer;
• forming a routing line from a first portion of the metal layer by selectively removing a second portion of the metal layer;
• forming a pillar in the via, wherein the pillar extends through the insulative base and contacts the metal base, the insulative base and the metal layer in the via;
• then
• mechanically attaching a chip to the laminated structure using an adhesive, wherein the chip includes a pad, a conductive trace includes the routing line and the pillar, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip, and the pillar contacts the routing line;
• then
• removing a portion of the metal base that contacts the pillar, thereby electrically isolating the pillar from other pillars that extend through the insulative base;
• and
• forming a connection joint that contacts and electrically connects the routing line and the pad.

A method of making a semiconductor chip assembly, comprising:

• providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base;
• forming a via in the laminated structure that extends through the metal base, the insulative base and the metal layer;
• forming a conductive trace that includes a routing line and a pillar, wherein the routing line and the pillar are different materials, the routing line is formed from an unetched portion of the metal layer, and the pillar contacts the metal base, the insulative base and the routing line in the via, extends across the opposite sides of the insulative base, and extends into the metal base and the routing line;
• then
• mechanically attaching a chip to the laminated structure using an adhesive, wherein the chip includes a pad, the metal base is disposed on a side of the insulative base that faces away from the chip, and the routing line is disposed on a side of the insulative base that faces towards the chip;
• then
• removing a portion of the metal base that contacts the pillar, thereby electrically isolating the pillar from other pillars that extend through the insulative base, wherein the pillar includes an exposed protruding portion that extends beyond the insulative base in a direction away from the chip;
• and
• forming a connection joint that contacts and electrically connects the routing line and the pad.

A method of making a semiconductor chip assembly, comprising:

• providing a laminated structure that includes a metal base, an insulative base and a metal layer, wherein the metal base and the metal layer are disposed on opposite sides of the insulative base;
• forming a via in the laminated structure that extends through the metal base, the insulative base and the metal layer and has open opposing ends;
• providing a plug that seals the via at one end such that the via has a sealed end and an unsealed end;
• depositing an electrically conductive material into the via from the unsealed end while the plug provides the sealed end, wherein the electrically conductive material contacts the plug, the metal base, the insulative base and the metal layer in the via;
• removing the plug;
• forming a conductive trace that includes a routing line and a pillar, wherein the routing line is formed from an unetched portion of the metal layer, the pillar is formed from the electrically conductive material, and the pillar contacts the metal base, the insulative base and the routing line in the via, extends across the opposite sides of the insulative base, and extends into the metal base and the routing line;
• mechanically attaching a chip to the laminated structure using an adhesive, wherein the chip includes a pad, the metal base is disposed on a side of the insulative base that faces away from the chip, and the routing line is disposed on a side of the insulative base that faces towards the chip;
• then
• removing a portion of the metal base that contacts the pillar, thereby electrically isolating the pillar from other pillars that extend through the insulative base, wherein the pillar includes an exposed protruding portion that extends beyond the insulative base in a direction away from the chip;
• and
• forming a connection joint that contacts and electrically connects the routing line and the pad.