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US 6,583,035 B2Granted
Semiconductor package with a controlled impedance bus and method of forming same
AssigneeRambus Inc.
InventorsNader Gamini, Donald V. Perino
Life of this patent
Estimating the term…
Abstract
An apparatus includes a first substrate having a set of semiconductor devices formed within it. The apparatus also includes a second substrate. A third substrate has a data conductor coupled between first and second connections to the second substrate. The data conductor is coupled to the set of semiconductor devices at respective connection points.
Claims29
A method of forming a semiconductor system, said method comprising the steps of:
- forming a plurality of semiconductor devices in a wafer having a surface wherein each semiconductor device of said plurality of semiconductor devices is designed for independent operability and is electrically isolated within said wafer from adjacent semiconductor devices of said plurality of semiconductor devices by scribe lanes, said forming step including the step of forming within each semiconductor device, a set of input nodes and a set of output nodes on the surface of said wafer;
- grouping a set of semiconductor devices that are adjacent to one another on said wafer;
- and
- applying an interconnect channel to said set of semiconductor devices so as to electrically link input nodes and output nodes of each semiconductor device within said set of semiconductor devices.
1 more element
A method of forming an integrated circuit, said method comprising the steps of:
- forming, on a semiconductor substrate, a set of semiconductor devices separated by scribe lanes;
- and
- forming an interconnect channel extending across selected scribe lanes to electrically connect at least two semiconductor devices of said set of semiconductor devices.
Dependencies are inferred from the claim text.