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US 6,583,019 B2Granted
Perimeter anchored thick film pad
AssigneeGennum Corporation
InventorsMark Vandermeulen, David Roy
Life of this patent
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Abstract
A thick film circuit with a perimeter anchored thick film pad is provided. The thick film circuit includes a base substrate, a thick film bonding pad, and a solder mask layer. The thick film bonding pad is formed on the surface of the base substrate. The solder mask layer is also formed on the surface of the base substrate, and overlaps a portion of the thick film bonding pad in order to improve adhesion between the thick film bonding pad and the base substrate.
Claims21
A thick film circuit, comprising:
- a base substrate having a surface;
- a thick film bonding pad formed on the surface of the base substrate;
- and
- a solder mask layer formed on the surface of the base substrate and overlapping a portion of the thick film bonding pad;
- wherein-the base substrate is a ceramic substrate.
2 more elements
Dependencies are inferred from the claim text.