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US 6,582,889 B1Granted
Method for forming resist pattern and manufacturing method of thin-film element
AssigneeTDK Corporation
InventorAkifumi Kamijima
Life of this patent
Estimating the term…
Abstract
A two layer structure resist pattern with a T-shaped cross section, consisting of a lower layer and an upper layer with overhang portions is formed, and then the formed two layer structure resist pattern is heat-treated so that the overhang portions of the upper layer incline downward.
Claims27
A method for forming a resist pattern, comprising the steps of:
- forming a two layer structure resist pattern with a T-shaped cross section, said two layer structure resist pattern consisting of a lower layer made of a resin material and an upper layer made of a resist material with overhang portions;
- and
- heat-treating the formed two layer structure resist pattern at a temperature within a range of 70 to 130° C. so that said overhang portions of said upper layer incline downward,
- wherein the heat-treating step includes heating the formed two layer structure resist pattern so that said overhang portions of said upper layer incline downward by 10 to 25 degrees.
1 more element
A method for manufacturing a thin-film element, comprising the steps of:
- forming a two layer structure resist pattern with a T-shaped cross section, said two layer structure resist pattern consisting of a lower layer made of a resin material and an upper layer made of a resist material with overhang portions;
- heat-treating the formed two layer structure resist pattern at a temperature within a range of 70 to 130° C. so that said overhang portions of said upper layer incline downward;
- and
- patterning a thin-film using the heat-treated two-layer structure resist pattern,
- wherein the heat-treating step includes heating the formed two layer structure resist pattern so that said overhang portions of said upper layer incline downward by 10 to 25 degrees.
2 more elements
A method for manufacturing a thin-film element, comprising the steps of:
- depositing a layer to be patterned on a substrate;
- forming a two layer structure resist pattern with a T-shaped cross section on said layer to be patterned, said two layer structure resist structure resist pattern consisting of a lower layer made of a resin material and an upper layer made of a resist material with overhang portions;
- heat-treating the formed two layer structure resist pattern at a temperature within a range of 70 to 130° C. so that said overhang portions of said upper layer incline downward;
- and
- dry-etching said layer to be patterned, using the heat-treated two layer structure resist pattern,
- wherein the heat-treating step includes heating the formed two layer structure resist pattern so that said overhang portions of said upper layer incline downward by 10 to 25 degrees.
3 more elements
A method for manufacturing a thin-film element, comprising the steps of:
- forming a two layer structure resist pattern with a T-shaped cross section on a substrate, said two layer structure resist pattern consisting of a lower layer made of a resin material and an upper layer made of a resist material with overhang portions;
- heat-treating the formed two layer structure resist pattern at a temperature within a range of 70 to 130° C. so that said overhang portions of said upper layer incline downward;
- and
- depositing a layer to be patterned, using the heat-treated two layer structure resist pattern
- wherein the heat-treating step includes heating the formed two layer structure resist pattern so that said overhang portions of said upper layer incline downward by 10 to 25 degrees.
2 more elements
A method for manufacturing a thin-film element, comprising the steps of:
- depositing a first layer to be patterned on a substrate;
- forming a two layer structure resist pattern with a T-shaped cross section on said first layer to be patterned, the two layer structure resist pattern consisting of a lower layer made of a resin material and an upper layer made of a resist material with overhang portions;
- heat-treating the formed two layer structure resist pattern at a temperature within a range of 70 to 130° C. so that said overhang portions of said upper layer incline downward;
- dry-etching said first layer to be patterned, using the heat-treating two layer structure resist pattern;
- and
- depositing a second layer to be patterned, using the heat-treated two layer structure resist pattern,
- wherein the heat-treating step includes heating the formed two layer structure resist pattern so that said overhang portions of said upper layer incline downward by 10 to 25 degrees.
4 more elements
Dependencies are inferred from the claim text.