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AssigneeNippon Mektron, Ltd.
InventorsLin-chiu Chiang, Jenq-Tain Lin, Nobuyuki Sensui
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Polyimide is produced by reacting two kinds of diamine compounds consisting of diaminopolysiloxane and a carboxyl group-containing diamine or three kinds of diamine compounds consisting of diaminopolysiloxane, a carboxyl group-containing diamine and an aromatic or alicyclic diamine with a dicarboxylic acid anhydride having a 2,5-dioxotetrahydrofuryl group as one acid anhydride group, thereby once forming a polyamic acid, and subjecting the polyamic acid to polyimidization reaction. The resulting polyimide itself is soluble in low boiling organic solvents for general purpose use, typically methyl ethyl ketone. A photosensitive composition comprising the polyimide, a photo crosslinking agent and a photo acid-generating agent forms a negative type polyimide pattern upon development with an aqueous alkali solution.
A polyimide that is soluble in an aqueous solution of an alkaline compound which comprises a copolymer of two kinds of diamine compounds consisting of diaminopolysiloxane and a carboxyl group-containing diamine;
A process for producing a polyimide that is soluble in an aqueous solution of an alkaline compound which comprises reacting two kinds of diamine compounds consisting of diaminopolysiloxane and a carboxyl group-containing diamine with a dicarboxylic acid anhydride having 2,5-dioxotetrahydrofuryl group as one acid anhydride group, thereby once forming a polyamic acid, and then subjecting the polyamic acid to polydimidization reaction.
A photosensitive composition, which comprises a polyimide comprising a copolymer of three kinds of diamine compounds consisting of diaminopolysiloxane, a carboxyl group-containing diamine and an aromatic or alicyclic diamine;
Dependencies are inferred from the claim text.