Method of treatment with a microwave plasma
AssigneeToyo Seikan Kaisha, Ltd.
InventorsTsunehisa Namiki, Toshihide Ieki, Akira Kobayashi, Koji Yamada, Hideo Kurashima
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Abstract
Disclosed is a method of treatment with a microwave plasma by maintaining a reduced pressure in a plasma-treating chamber for treatment with a plasma in which a substrate that is to be treated with a microwave plasma is contained, introducing a treating gas into the plasma-treating chamber and introducing microwaves into the plasma-treating chamber, wherein a metallic antenna is disposed in the plasma-treating chamber. The plasma is generated within a very short period of time maintaining stability after the microwaves are introduced into the plasma-treating chamber, and the treatment is accomplished maintaining stability.
Claims17
A method of treatment with a microwave plasma by maintaining a reduced pressure in a plasma-treating chamber for treatment with a plasma in which a substrate that is to be treated is contained, introducing a treating gas into the plasma-treating chamber and introducing microwaves into the chamber, wherein a metallic antenna is disposed in the chamber separate from a means for introducing microwaves into the plasma-treating chamber, said metallic antenna concentrating microwaves emitted in the chamber so as to promote the formation of plasma.
A method of treatment with a microwave plasma by maintaining a reduced pressure in a plasma-treating chamber for treatment with a plasma in which a substrate that is to be treated is contained, introducing a treating gas into the plasma-treating chamber and introducing microwaves into the chamber, wherein metallic antenna means is disposed in the chamber for emitting electrons which promote the formation of plasma upon introducing microwaves into the chamber, said metallic antenna being provided separate from a means for introducing microwaves into the plasma-treating chamber.
Dependencies are inferred from the claim text.