Tungsten target for sputtering and method for preparing thereof
AssigneeNikko Materials Co., Ltd.
InventorsSatoru Suzuki, Hirohito Miyashita
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Abstract
A tungsten powder having a powder specific surface of 0.4 m2/g or more is hot-pressed at a temperature of 1,600° C. or more and then subjected to HIP at a temperature of 1,700° C. or more without capsuling, whereby a tungsten target for sputtering is manufactured that has a relative density of 99% or more and an average crystal grain size of 100 μm or less. This manufacturing method can manufacture, stably at a low cost, a tungsten target having such a high density and fine crystal structure as cannot be attained by the conventional pressure sintering method, and can greatly decrease the number of particle defects on a film produced by using such a target.
Claims1
A manufacturing method of a tungsten target for sputtering, consisting of the steps of:
- hot-press-sintering a tungsten powder having a powder specific surface of 0.6 m2/g or more as measured according to a BET method in a vacuum or a reducing atmosphere at a temperature of at least 1,600° C. and a pressure of at least 200 kg/cm2 to produce a sintered body having a relative density of at least 93%:
- and
- performing hot isotropic pressure sintering (HIP) on said sintered body at a temperature of at least 1,700° C. and a pressure of at least 1,000 kg/cm2 without capsuling:
- wherein, after aid hot isotropic pressure sintering step said sintered body has a relative density of at least 99%, an average grain size of no greater than 100μm, and an oxygen content of no greater than 20 ppm.
Dependencies are inferred from the claim text.