Emissivity-change-free pumping plate kit in a single wafer chamber

An apparatus for fabricating an integrated circuit device comprising:

• an enclosure housing a processing chamber, said processing chamber having an inner wall;
• a processing chamber lid;
• a pumping plate for said processing chamber comprising a cylindrical body member having an outer wall, a top edge defining an open top, a bottom edge, and a ledge protruding from said outer wall, said ledge having an upper surface and a lower surface;
• a first pumping channel defined by said outer wall of said pumping plate, said upper surface of said ledge, said inner wall of said processing chamber, and said chamber lid;
• and
• a second pumping channel defined by said outer wall of said pumping plate, said lower surface of said ledge, and said inner wall of said processing chamber.