Ultrasound probe wiring method and apparatus
AssigneeKoninklijke Philips Electronics N.V.
InventorDavid G. Miller
Life of this patent
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Abstract
Wiring an IC, using flexible circuits, by relating a circuit board to an IC and using traces on the circuit board as a second set of input to the IC. More specifically, a set of first lands on the circuit board are connected to a first set of lands on the IC. The circuit board and IC are positioned so as to present a second set of lands on the circuit board in close proximity to a second set of lands on the IC. A first flex circuit is connected to the second lands on the circuit board while a second flex circuit is connected to the second lands on the IC. The flex circuits may be connected to signal wires or may serve themselves as the main signal wires.
Claims7
An ultrasound probe comprising:
- a plurality of transducer elements;
- an IC having a first and second set of lands on two different areas thereof, the IC being connected to the plurality of transducer elements via a communication channel there between;
- a circuit board bonded to the IC, the circuit board having a first and second set of lands on two different areas thereof, the first set of lands being electrically connected to the second set of lands, wherein the first set of lands is in close proximity to the first set of lands on the IC and the second set of lands being connected to the second set of lands on the IC;
- a first flex circuit connected to the first lands of the circuit board so that electrical leads on the flex circuit are in communication with the second set of lands on the IC;
- and
- a second flex circuit connected to the first set of lands on the IC.
Dependencies are inferred from the claim text.