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US 6,582,282 B2Granted
Chemical mechanical polishing with multiple polishing pads
AssigneeApplied Materials, Inc.
InventorSasson Somekh
Life of this patent
Estimating the term…
Abstract
In chemical mechanical polishing, a substrate is planarized with one or more fixed-abrasive polishing pads. Then the substrate is polished with a standard polishing pad to remove scratch defects created by the fixed-abrasive polishing pads.
Claims9
A method of polishing a substrate having a copper layer, comprising:
- chemical mechanical polishing the copper layer with a fixed-abrasive polishing pad to substantially planarize and remove the copper layer;
- and
- chemical mechanical polishing a barrier layer beneath the copper layer with a non-fixed-abrasive polishing pad to substantially remove the barrier layer and scratches from the substrate.
Dependencies are inferred from the claim text.