Polyimide coating process with dilute TMAH and DI-water backrinse

An apparatus for imparting a coating to a first surface of a semiconductor wafer, the apparatus comprising:

• a coater cup having a bottom portion;
• a spin chuck disposed within the coater cup, for supporting the semiconductor wafer and imparting rotational motion to the wafer, wherein the spin chuck comprises a platen portion for supporting the semiconductor wafer at a second surface and comprises a shaft portion extending in a substantially normal orientation from the platen portion through the bottom portion of the coater cup;
• a first nozzle extending into the coater cup through the bottom portion for injecting a developing fluid onto the back side of the wafer in the coater cup;
• and
• a second nozzle extending into the coater cup through the bottom portion for injecting a rinsing fluid onto the back side of the wafer in the coater cup, wherein the first nozzle and the second nozzle each extend into the coater cup through the bottom portion of the coater cup and wherein the second nozzle is positioned nearer the shaft portion than is the first nozzle.

An apparatus for imparting a coating to a first surface of a semiconductor wafer, the apparatus comprising:

• a coater cup having a bottom portion;
• a spin chuck disposed within the coater cup, for supporting the semiconductor wafer and imparting rotational motion to the wafer;
• a first nozzle extender into the coater cup through the bottom portion for injecting a rinsing fluid onto the back side of the wafer in the coater cup;
• a second nozzle extending into the coater cup through the bottom portion for injecting a rinsing fluid onto the back side of the wafer in the coater cup;
• and
• a bulk drain connected to the coater cup for collecting a mixture comprising excess coating and the developing fluid.