Sheet-framed IC carrier and method for producing the same
AssigneeDai Nippon Printing Co., Ltd.
InventorsMitsunori Takeda, Eiichi Igarashi, Hideyo Yoshida
Life of this patent
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Abstract
A frame sheet comprises a core sheet, and oversheets. A recess is formed in the sheet frame. The oversheet is left in the recess in the sheet frame, and an IC carrier is mounted in the recess. The IC carrier is held, adhered to the oversheet left in the recess.
Claims5
A method for producing a sheet-framed IC carrier comprising (1) a sheet frame having a core sheet, a fusion-preventing layer provided on a portion of the core sheet, and an oversheet provided on a surface of the core sheet, having the fusion-preventing layer, the sheet frame having a recess therein, the recess not including a portion of the oversheet, and (2) an IC carrier mounted in the sheet frame recess and held by the portion of the oversheet not included in the recess, the IC carrier having an IC module, the method comprising the steps of:
- providing the core sheet;
- forming the fusion-preventing layer on a portion of the core sheet corresponding to the IC carrier;
- laying the oversheet on the fusion-preventing layer and the core sheet;
- press-fusing the core sheet, fusion-preventing layer, and oversheet to form a sheet frame;
- spot-facing the core sheet to form the recess in the sheet frame;
- forming a peripheral slit in the core sheet to constitute a peripheral edge of the IC carrier;
- and
- mounting the IC module in the sheet frame recess.
Dependencies are inferred from the claim text.