Lead bonding method for SMD package
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJong-Sung Jung, Jong-Tae Kim, Guem-Young Youn, Chang-Dug Kim
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Abstract
Disclosed herein is a lead bonding method for SMD packages. The lead bonding method includes the step of placing a package body with its lead-positioning surface facing upward. A lead with solder is arranged on the lead-positioning surface of the package body using vision system. The lead is spot-welded onto the package body to fix the lead to the package body. The package body spot-welded together with the lead is arranged in a positioning depression of a jig with the lead facing downward. The solder formed on the lead are melted to bond the lead to the package body.
Claims8
A lead bonding method, comprising the steps of:
- placing a package body with its lead-positioning surface facing upward;
- arranging a lead with solder on the lead-positioning surface of the package body;
- spot-welding the lead onto the package body to fix the lead to the package body thereby to maintain the proper position of the lead and the package body;
- providing the package body spot-welded together with the lead in a positioning depression of a jig with the lead facing downward;
- and
- bonding the lead to the package body by melting the solder formed on the lead thereby to connect the lead and package body electrically.
Dependencies are inferred from the claim text.