Capillary for bonding copper wires between a semiconductor circuit chip and a corresponding terminal connector of a semiconductor device

A capillary for electrically bonding a semiconductor chip and corresponding pins of a semiconductor device, the capillary comprising:

• a body comprising a terminal portion that is substantially frustum-shaped and having a diametrical through hole for allowing passage of a copper wire therethrough for forming a copper ball, a lower end of the through hole having a diameter between a range of about 53.5 and 56.5 microns, said terminal portion comprising
• a flared portion having a flared diameter and a flared angle adjacent the lower end of the through hole for allowing formation of a substantially flat annular peripheral region on the copper ball when deformed by action of said body, the flared angle being between a range of about 115 and 125 degrees, and with the formation of the substantially flat annular peripheral region being substantially independent of the position of the copper wire within the diametrical through hole of said body.