Apparatus for mounting electronic components
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsKazuo Mori, Osamu Okuda, Hiroshi Uchiyama, Akira Kabeshita
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Abstract
A slide-type solvent transfer unit is used, and a plurality of nozzles at a head part which suck and hold components are moved down simultaneously to transfer flux to electronic components. In comparison with an electronic component mounting method including a transfer operation whereby nozzles are lowered one by one by a conventional electronic component mounting apparatus equipped with a rotary type solvent transfer unit, the time required for moving the nozzles up and down is shortened and a total cycle time is reduced, so that production efficiency is improved.
Claims8
An electronic component mounting method comprising:
- relatively and linearly sliding one of a solvent transfer part and a film-forming blade in a flux transfer unit comprising the solvent transfer part at which a film of a solvent to be transferred to electronic components is formed, and the film-forming blade for forming the solvent film at the solvent transfer part, thus forming the solvent film at the solvent transfer part;
- and
- thereafter transferring the solvent to the electronic components by bringing the components held by component holding members into contact with the film of the solvent simultaneously.
Dependencies are inferred from the claim text.