Method for filling high aspect ratio via holes in electronic substrates
AssigneeInternational Business Machines Corporation
InventorsBrian Eugene Curcio, Peter Alfred Gruber, Frederic Maurer, Konstantinos I. Papathomas, Mark David Poliks
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Abstract
High aspect ratio (5:1-30:1) and small (5 μm-125 μm) diameter holes in a dielectric substrate are provided, which are filled with a solidified conductive material, as well as a method of filling such holes using pressure and vacuum. In certain embodiments, the holes are lined with conductive material and/or capped with a conductive material. The invention also contemplates a chip carrier formed by such material.
Claims18
A method of forming a capped conductive through hole in a dielectric substrate comprising the steps of:
- providing a dielectric substrate having opposed faces therein, said at least one through hole having two ends extending;
- forming at least one through hole from one face to the other face having an aspect ratio of from about 5:1 to about 30:1, and a diameter of from about 5 μm to about 125 μm;
- applying pressure from one end of the said at least one through hole with injecting liquid conducting material and providing a vacuum at the opposite end of said at least one through hole, thereby filling said at least on through hole with said liquid conducting material under pressure and providing a vacuum at the opposite end thereof;
- allowing the liquid conducting material to solidify;
- and
- forming a separate cap of conductive material over said filled hole.
A method of forming a capped conductive through hole in a dielectric substrate comprising the steps of:
- providing a dielectric substrate having opposed faces and at least one power plane buried thereon;
- forming at least one through hole therein, said at least one through hole having two ends extending from one face to the other face having an aspect ratio of from about 5:1 to about 30:1, and a diameter of from about 5 μm to about 125 μm;
- plating conductive material on the surface of at least one hole;
- applying pressure from one end of the said at least one through hole with injecting liquid conducting material and providing a vacuum at the opposite end of said at least one through hole, thereby filling said at least on through hole with said liquid conducting material under pressure and providing a vacuum at the opposite end thereof;
- allowing the liquid conducting material to solidify;
- and forming a separate cap of conductive material over said filled hole.
Dependencies are inferred from the claim text.