US 6,581,279 B1Granted

Method of collectively packaging electronic components

AssigneeCommissariat a l'Energie Atomique

InventorsPierre Gidon, Paul Philippe

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Abstract

Method of collectively packaging a plurality of electronic components formed in a first substrate, wherein the electronic components are separated from one other by separation strips associated with a plurality of conducting tracks formed on a second substrate. The conducting tracks on the second substrate are associated with contact pads of the components in the first substrate. Each conducting track on the second substrate includes a connection strip arranged to coincide with associated depressions in the first substrate when the first and second substrates are mated. After mating, the components are separated into individualized electronic modules by forming proximal trenches in the first substrate and distal trenches in the second substrate. The proximal trenches are formed around the components in the first substrate to open up into the depressions in the first substrate. The distal trenches are formed further away from the components than the proximal trenches in regions comprising the connection strips on the second substrate.

A method of collectively packaging a plurality of components (102) formed in a first substrate board (100) and separated from each other by separation strips (106), each component (102) comprising at least one contact pad (108) flush with a first surface (104) of the first board (100), the method comprising the steps of:

a) forming a depression (120) in each of the separation strips (106) of the first board (100);
b) forming a plurality of conducting tracks (208) on a second substrate board (200), each conducting track (208) being associated with a corresponding contact pad (108) of a component (102) on the first board (100), and each conducting track (208) including a connection strip (209) arranged to coincide with an associated depression (120) on the first substrate board (100), when the first and second substrate boards (100, 200) are assembled;
c) assembling the first and second substrate boards (100, 200) so as to bring the contact pads (108) of the components (102) of the first substrate board (106) into electrical contact with the corresponding tracks (208) on the second substrate board (208), and to make each connection strip (209) on the second board (200) coincide with a corresponding depression (120) on the first substrate board (100);
and
d) cutting out the first board (100) by forming proximal trenches (130) around the components (102), the proximal trenches opening up into the depressions (120) in the separation strips (106), and cutting out the second board (200) by forming distal trenches (230) further away from the components (102) than the proximal trenches (130) in regions comprising the connection strips, to allow the connection strips (209) on the second board (200) to project at least partially beyond at least one edge of the first board (100), the first and second cut outs being used to individualize modules (300), each module formed of a portion of the first board (100) comprising at least one component (102) and a portion of the second board (200).

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Abstract

Claims13