Antenna integrated ceramic chip carrier for a phased array antenna
AssigneeThe Boeing Company
InventorsJulio Angel Navarro, Douglas Allan Pietila
Life of this patent
Estimating the term…
Abstract
An integrated ceramic chip carrier module for a phased array antenna. The module is comprised of a plurality of layers of low temperature, co-fired ceramic formed into an integrated module. The module combines the injection molded probes, button layer and holder, and the ceramic chip carrier into a single integrated component part. This construction provides for improved performance, reliability, manufacturing repeatability, and lower overall antenna manufacturing costs.
Claims13
An integrated ceramic chip carrier module for a phased array antenna comprising:
- at least one antenna probe formed on an antenna probe layer;
- a chip carrier structure adapted to support an integrated circuit chip formed on an input/output layer;
- an integrally formed waveguide layer disposed between said antenna probe layer and said input/output layer;
- at least one electrical interconnect for electrically interconnecting said antenna probe and said integrated circuit chip;
- and
- wherein said antenna probe layer, said chip carrier structure and said electrical interconnect are integrally formed as a ceramic, co-fired muitilayer module.
An integrated ceramic chip carrier module for a phased array antenna comprising:
- at least one radio frequency (RF) antenna probe formed within an RF antenna probe layer;
- an input/output layer having a chip carrier structure adapted to support an integrated circuit chip;
- a waveguide layer disposed inbetween said RF antenna probe layer and said input/output layer;
- at least one vertical electrical interconnect for electrically interconnecting said antenna probe and said integrated circuit chip;
- and
- wherein said antenna probe layer, said input/output layer, said electrical interconnect are said waveguide layer are integrally formed as a single, ceramic, co-fired multilayer module.
An integrated ceramic chip carrier module for a phased array antenna comprising:
- a first co-fired ceramic layer having at least one radio frequency (RE) antenna probe formed thereon
- a second co-fired ceramic layer having an input/output layer having a chip carrier structure adapted to support a monolithic microwave integrated circuit (MMIC) chip;
- a third co-fired ceramic layer forming a waveguide disposed between said first ceramic layer and said input/output layer;
- a fourth co-fired ceramic layer having a radio frequency (RE) and trace circuit formed thereon;
- and
- at least one vertical electrical interconnect extending axially through a plurality of said layers for electrically interconnecting at least said antenna probe and said integrated circuit chip.
A phased array antenna comprising:
- a support structure having a plurality of recesses for supporting a corresponding plurality of integrated antenna modules;
- each said integrated antenna module including:
- a first co-fired ceramic layer having a radio frequency (RE) probe formed thereon;
- a second co-fired ceramic layer having an input/output layer having a chip carrier structure adapted to support a monolithic microwave integrated circuit (MMIC) chip;
- a third co-fired ceramic layer forming a waveguide disposed between said first ceramic layer and said input/output layer;
- a fourth co-fired ceramic layer having a radio frequency (HF) and trace circuit formed thereon;
- and
- at least one vertical electrical interconnect extending axially through a plurality of said layers for electrically interconnecting at least said antenna probe and said integrated circuit chip.
A method for forming an integrated ceramic chip carrier module for a phased array antenna comprising:
- forming at least one antenna probe formed on a first ceramic layer;
- forming an input/output circuit having a chip carrier structure adapted to support an integrated circuit chip, said input/output layer being formed on a second ceramic layer;
- forming a waveguide from at least one third ceramic layer between said first ceramic layer and said second ceramic layer;
- forming a plurality of electrical interconnects in each of said first, second and third ceramic layers which are vertically aligned with one another when said ceramic layers are disposed against one another, for electrically interconnecting at least said antenna probe and said input/output layer;
- and
- co-firing said first, second and third ceramic layers to produce said integrated ceramic chip carrier module.
Dependencies are inferred from the claim text.