Surface acoustic wave device having a thin metal oxide film fully covering at least the electrodes and method of fabricating same
AssigneeTDK Corporation
InventorsMasahiro Nakano, Michiyuki Nakazawa, Katsuo Sato
Life of this patent
Estimating the term…
Abstract
A surface acoustic wave device includes a piezoelectric substrate having Al or Al alloy electrodes formed on a surface of the substrate, a metal oxide film provided on the substrate and the electrodes. The metal oxide film is formed by a process including depositing a metal thin film having a thickness sufficiently thin so that the deposited metal thin film is discontinuous including voids, and oxidizing the discontinuous metal thin film, and the metal oxide film includes a continuous portion without voids covering the electrodes.
Claims25
A surface acoustic wave device, comprising:
- a piezoelectric substrate having Al or Al alloy electrodes formed on a surface of said substrate;
- a metal oxide film provided on said substrate and said electrodes, said metal oxide film formed by a process including depositing a metal thin film having a thickness sufficiently thin so that the deposited metal thin film is discontinuous including voids, and oxidizing the discontinuous metal thin film;
- and
- said metal oxide film comprising a continuous portion without voids covering said electrodes.
A surface acoustic wave device, comprising:
- a piezoelectric substrate having Al or Al alloy electrodes formed on a surface of said substrate;
- a metal oxide film provided on said substrate and said electrodes, said metal oxide film formed by a process including depositing a metal thin film having a thickness sufficiently thin so that the deposited metal thin film is discontinuous including voids, and oxidizing the discontinuous metal thin film;
- and
- said metal oxide film comprising a continuous portion without voids covering said electrodes,
- wherein said continuous portion of said metal oxide film has a thickness of approximately 0.1 to 2 nm.
A surface acoustic wave device, comprising:
- a piezoelectric substrate having Al or Al alloy electrodes formed on a surface of said substrate;
- a metal oxide film provided on said substrate and said electrodes, said metal oxide film formed by a process including depositing a metal thin film having a thickness sufficiently thin so that the deposited metal thin film is discontinuous including voids, and oxidizing the discontinuous metal thin film;
- and
- said metal oxide film comprising a continuous portion without voids covering said electrodes, and a discontinuous portion including voids provided on said surface of said piezoelectric substrate.
A process for forming a surface acoustic wave device, comprising:
- forming, on a surface of a piezoelectric substrate having Al or Al alloy electrodes provided thereon, a metal oxide film, comprising,
- depositing a metal thin film having a thickness sufficiently thin so that the deposited metal thin film is discontinuous including voids, and
- oxidizing the discontinuous metal thin film, said metal oxide film comprising a continuous portion without voids covering at least said electrodes.
Dependencies are inferred from the claim text.