Modular mounting arrangement and method for light emitting diodes

A lighting system comprising:

• a plurality of lighting modules adapted to be mounted on a surface of a heat conductive member, each module comprising:
• a plurality of light emitting diodes (LEDs);
• a plurality of electrically conductive contacts, each of the LEDs electrically communicating with at least one of the contacts in a manner so that the LEDs are configured in a series array on the module;
• and
• a dielectric layer supporting the contacts;
• wherein the modules are electrically interconnected so that the series array of each module is electrically parallel to the series array of others of the modules;
• and
• wherein the interconnected modules are arranged in a dispenser such that a selected portion of the interconnected modules may be successively dispensed from the dispenser and removed therefrom.

A method of mounting a plurality of lighting modules on a heat conducting surface so that heat from to modules is drawn into the heat conductive surface, comprising:

• providing a plurality of lighting modules that are successively electrically interconnected with one another, each module comprising;
• a plurality of light emitting diodes (LEDs);
• a plurality of electrically conductive contacts, each of the LEDs electrically communicating with at least one of the contacts in a manner so that the LEDs are configured in a series array;
• and
• a dielectric layer having a first side and a second side, the contacts being connected to the first side;
• wherein the series array of each module is connected in an electrically parallel fashion with the series arrays of the other modules;
• providing a dispenser, the dispenser configured to contain the plurality of interconnected modules;
• drawing successive modules from the dispenser;
• and
• successively mounting the modules to the heat conductive surface using a thermally conductive tape.