Substrate for use of an ink jet recording head, a method for manufacturing such substrate, an ink jet recording head, and an ink jet recording apparatus

A method for manufacturing a substrate for use in an ink jet recording head having a plurality of heat generating resistive members formed by polysilicon;

• a wiring to be electrically connected with said heat generating resistive members;
• and a protection film formed on said best generating resistive members and said wiring to protect them from ink, wherein a side of said wiring is connected with said heat generating resistive members being positioned immediately below said heat generating resistive members through an insulation film positioned at a lower layer of said heat generating resistive members,
• the method comprising the steps of:
• forming a polysilicon wiring on the substrate;
• forming the insulation film covering the polysilicon wiring and having a first through hole provided at a heat generating resistive member forming position and a second through hole provided at a position away from said heat generating resistive member forming position;
• on the insulation film, forming a said heat generating resistive member, to be connected with the polysilicon wiring through the first through hole, formed by polysilicon having a resistive characteristic higher than the polysilicon forming the polysilicon wiring;
• forming a first metallic wiring, to be connected with the polysilicon wiring through the second through hole on the insulation film subsequent to the formation of said heat generating resistive members;
• forming a first protection film covering the heat generating resistive members and the first metallic wiring and having a third through hole exposing said heat generating resistive member;
• forming a second metallic wiring, to be connected with said heat generating resistive members through the third through hole on the first protection film;
• and
• forming a second protection film covering the second metallic wiring,
• wherein said first and second metallic wiring is Al or Cu individually or an alloy thereof.