Film formation apparatus comprising movable gas introduction members
AssigneeFuji Daiichi Seisakusho Co., Ltd.
InventorsKiyotoshi Sakamoto, Tatsuo Morita
Life of this patent
Estimating the term…
Loading patent…
AssigneeFuji Daiichi Seisakusho Co., Ltd.
InventorsKiyotoshi Sakamoto, Tatsuo Morita
Estimating the term…
A film formation apparatus for plasma CVD and etching methods making use of inductive coupling plasma generators. The apparatus comprises a plurality of plasma generators for inductive coupling methods, one or more film formation gas discharge pipes, and a substrate setting table facing the plurality of plasma generators via a reaction zone. The film formation gas discharge pipes are included in each of two movable members capable of performing reciprocating motions along a substrate surface on the substrate setting table, while intersecting each other. Thereby, a plasma with a relatively high density can be uniformly created over a large area, the film formation gas excited by free radicals in the plasma can uniformly spread over the film formation target, and a film can be formed with a high deposition rate. Consequently, a large-sized substrate with a good quality of thin film can be provided.
A film formation apparatus, comprising:
Dependencies are inferred from the claim text.