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US 6,578,262 B2Granted
Heat transfer material for an improved die edge contacting socket
AssigneeMicron Technology, Inc.
InventorWarren M. Farnworth
Life of this patent
Estimating the term…
Abstract
An improved die edge contacting socket incorporates particles of a thermally conducting material into an elastomeric compression pad disposed in the sealing cap of the socket. The elastomeric compression pad is preferably composed of an electrically insulating material, such as a silicone-based gel. The thermally conducting material is preferably either diamond, beryllium oxide, silicon nitride, or a like material.
Claims13
A method for cooling a bare die mounted in a die chamber assembly, comprising the acts of:
- positioning an elastomeric pad adjacent a surface of the bare die exposed at a top portion of the die chamber assembly, wherein the elastomeric pad contains thermally conducting particles and the bare die is mounted in a substantially upright orientation relative to a bottom portion of the die chamber assembly;
- and
- removably contacting the surface with the elastomeric pad.
A method for cooling a bare die mounted in a die chamber assembly, comprising the acts of:
- contacting an exposed portion of the bare die with a thermally conducting elastomeric pad, wherein the bare die is mounted in a substantially upright orientation relative to a base of the die chamber assembly;
- and
- transferring heat from the bare die through the compression pad via the thermally conducting particles.
Dependencies are inferred from the claim text.