Method of manufacturing a thin film magnetic head

A method of manufacturing a thin film magnetic head including two magnetic layers magnetically coupled to each other having two magnetic poles which face each other with a gap layer in between and are to be faced with a recording medium, a thin film coil provided between the two magnetic layers, and an insulating layer for insulating the thin film coil from the two magnetic layers, one of the two magnetic layers including a first magnetic layer portion which extends from a recording-medium-facing surface facing the recording medium in a direction away from the recording-medium-facing surface and has a constant width portion defining a track width, and a second magnetic layer portion covering an area where the thin film coil is disposed and partially overlapping, and magnetically coupled to, the first magnetic layer portion, the method including:

• a first step of forming a first insulating layer portion constituting part of the insulating layer and defining an edge of the insulating layer closest to the recording-medium-facing surface, and simultaneously forming a second insulating layer portion constituting part of the insulating layer in a region located farther from the recording-medium-facing surface than a region where the first insulating layer portion is disposed;
• a second step of forming the first magnetic layer portion;
• a third step of forming a first thin film coil pattern constituting part of the thin film coil, and simultaneously forming a connection pattern integrally with the first thin film coil pattern over the second insulating layer portion;
• a fourth step of forming a third insulating layer portion constituting part of the insulating layer so as to cover at least the first magnetic layer portion, the first thin film coil pattern, the second insulating layer portion, and the connection pattern;
• a fifth step of polishing and planarizing a surface of the third insulating layer portion until at least both of the first magnetic layer portion and the connection pattern are exposed;
• and
• a sixth step of forming a conductive layer pattern to be electrically connected to the exposed position of the connection pattern.