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US 6,572,780 B2Granted
Methods for fabricating flexible circuit structures
AssigneeFujitsu Limited
InventorsMark Thomas McCormack, James Roman, Lei Zhang, Solomon I. Beilin
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Abstract
Improved methods and articles used to fabricate flexible circuit structures are disclosed. The methods include depositing a release layer or a dielectric film on a substrate, and then forming a conductive laminate on the release layer or the dielectric film. The conductive laminate may be easily separated by the substrate to eventually form a flexible circuit structure.
Claims7
A method for detaching a layer from a substrate comprising depositing on a substrate a first bonding material having a first bonding strength;
- depositing a release layer on the first bonding material;
- depositing on the release layer a second bonding material having at least one first bonding section and a second bonding section, said first bonding section includes a first bonding strength which is greater than a secondary bonding strength of the second bonding section;
- depositing a conductive layer on the second bonding material;
- and removing at least a portion of the conductive layer from at least a portion of the secondary bonding section.
1 more element
Dependencies are inferred from the claim text.