Methods apparatus for the electronic, homogeneous assembly and fabrication of devices

Abstract

Methods and apparatus are provided for the fabrication of microscale, including micron, sub-micron, and nanoscale, devices. Electronic transport of movable component devices is utilized through a fluidic medium to effect transport to a desired target location on a substrate or motherboard. Forces include electrophoretic force, electroosmotic force, electrostatic force and/or dielectrophoretic force. In the preferred embodiment, free field electroosmotic forces are utilized either alone, or in conjunction with, other forces. These forces may be used singly or in combination, as well as in conjunction with yet other forces, such as fluidic forces, mechanical forces or thermal convective forces. Transport may be effected through the use of driving electrodes so as to transport the component device to yet other connection electrodes. In certain embodiments, the connection electrodes may also be utilized, either alone or in combination with driving electrodes, to electronically transport the component device to the connection electrodes.

Dependencies are inferred from the claim text.