Polishing pad and method of manufacture
AssigneeLam Research Corporation
InventorXuyen Pham
Life of this patent
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Abstract
A method of joining sections of polishing pad for use in the chemical mechanical planarization of a semiconductor wafer. Two sections of polishing pad are positioned so that they contact one another. The two sections are then welded together to create a robust joint. The joint is resistant to infiltration of slurry and is not susceptible to delamination that commonly occurs in a typical laminate joint.
Claims10
A method of joining a first section of polishing pad for use in chemical mechanical planarization of a semiconductor wafer with a second section of polishing pad for use in chemical mechanical planarization of a semiconductor wafer, the method comprising:
- (a) positioning the first section of polishing pad such that a part of the first section of polishing pad overlaps a part of the second section of polishing pad;
- and
- (b) welding the first section of polishing pad to the second section of polishing pad.
A polishing pad for use in chemical mechanical planarization of a semiconductor wafer, the polishing pad comprising:
- a first section of polishing pad;
- and
- a second section of polishing pad welded to the first section of polishing pad,
- wherein the first section of polishing pad comprises a polishing pad portion and a cushioning pad portion, and
- wherein the second section of polishing pad is selected from the group consisting of polishing material and cushioning material.
A polishing pad for use in chemical mechanical planarization of a semiconductor wafer, the polishing pad comprising:
- a first section of polishing pad;
- and
- a second section of polishing pad welded to the first section of polishing pad,
- wherein the second section of polishing pad comprises a polishing pad portion and a cushioning pad portion, and
- wherein the first section of polishing pad is selected from the group consisting of polishing material and cushioning material.
Dependencies are inferred from the claim text.