Platform and optical module, method of manufacture thereof, and optical transmission device
AssigneeSeiko Epson Corporation
InventorAkihiro Murata
Life of this patent
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Abstract
A method of manufacturing a platform includes the steps of providing an interconnecting line adhering first and second regions of a mold, disposing an optical fiber with its end surface facing the mold, sealing the optical fiber and the interconnecting line with a molding material, and removing the interconnecting line and the molding material together with the optical fiber from the mold.
Claims35
A method of manufacturing a platform comprising steps of:
- providing a mold having first and second regions with an interconnecting line which adheres to at least one of the first and second regions;
- disposing an optical fiber with one end surface of the optical fiber facing the mold;
- sealing the optical fiber and the interconnecting line with a molding material, avoiding the one end surface and a surface of the interconnecting line which is in contact with the mold;
- and
- removing the interconnecting line and the molding material together with the optical fiber from the mold.
A platform comprising a resin molded component, and an interconnecting line at least part of which exposes from the molded component, the exposed surface of the at least part of the interconnecting line being level with a surface of the molded component, in which an optical fiber having one end surface exposed is fixed to the molded component.
A platform comprising:
- a molded component, the molded component having an indent formed therein;
- an interconnecting line at least part of which exposes from the molded component;
- and
- an optical fiber fixed to the molded component, the optical fiber fixed in the indent with its end surface exposed,
- wherein the indent has a plurality of bottom surfaces forming steps, and
- wherein on each of the bottom surfaces, the at least part of the interconnecting line is exposed.
An optical transmission device comprising:
- a plurality of platforms, each of the platforms having a molded component and an interconnecting line at least part of which exposes from the molded component;
- an optical fiber fixed to the molded component with its end surface exposed;
- and
- an optical element mounted over the molded component, the optical element being a light-receiving element or a light-emitting element, the optical element electrically connected to the exposed part of the interconnecting line,
- wherein an indent is formed in the molded component,
- wherein the optical fiber is fixed in the indent with the exposed end surface,
- wherein the indent has a plurality of bottom surfaces forming steps,
- wherein on each of the bottom surfaces, the at least part of the interconnecting line is exposed,
- wherein a semiconductor chip mounted over each of the platforms is further provided,
- wherein the optical element is mounted in the indent so as to face the one end surface of the optical fiber, and
- wherein the semiconductor chip is electrically connected to the interconnecting line, and is mounted within the indent so as to face a surface of the optical element opposite to a surface facing the optical fiber.
Dependencies are inferred from the claim text.