# US 6,568,054 B1 · Method of producing a multilayer electronic part

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- Number: US 6,568,054 B1
- Document ID: US6568054B1
- Status: Granted
- Kind: B1
- Application number: 09/512,643
- Filed: 2000-02-24
- Granted: 2003-05-27
- Earliest claimed: 1996-11-21
- Assignees: TKD Corporation
- Inventors: Shuumi Kumagai; Kouzou Sasaki; Makoto Kobayashi; Noriyuki Saito; Hisayuki Abe; Toru Takahashi; Kenji Shibata
- Web page: https://patentgrep.com/patent/US6568054B1

## CPC

- H03H 7/0115: {comprising only inductors and capacitors (H03H7/075, H03H7/09, H03H7/12, H03H7/13 take precedence)}
- H01F 17/0013: {with stacked layers}
- H01F 27/292: {Surface mounted devices}
- H01F 41/043: {by thick film techniques}
- H01F 41/046: {structurally combined with ferromagnetic material}
- H01F 2017/0026: {Multilayer LC-filter}
- H03H 2001/0057: {comprising magnetic material}
- H03H 2001/0085: {Multilayer, e.g. LTCC, HTCC, green sheets}
- Y10T 29/43: Electric condenser making
- Y10T 29/435: Solid dielectric type
- Y10T 29/49002: Electrical device making
- Y10T 29/49126: Assembling bases
- Y10T 29/4913: Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T 29/49135: and shaping, e.g., cutting or bending, etc.
- Y10T 29/49142: including metal fusion
- Y10T 29/49144: by metal fusion
- Y10T 29/49147: Assembling terminal to base
- Y10T 29/49179: by metal fusion bonding
- Y10T 29/49208: by assembling plural parts
- Y10T 29/49222: forming array of contacts or terminals
- H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P)
- H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A method of producing a multilayer electronic part having the shape of a substantially rectangular parallelopiped is constituted which has a multilayer body formed by superposing coil conductors and green sheets of a magnetic or nonmagnetic material. Terminal electrodes are formed respectively on both ends of the multilayer body along the direction of the magnetic flux generated when current is caused to flow through the coil conductors in the multilayer body. The terminal electrodes each has a conductive substrate formed within the area of the end of the multilayer body and including a lamination body as a component of the multilayer body.

## Claims

### Claim 1

A method for producing a multilayer electronic part comprising the steps of:
superposing a plurality of sheets each on which an L- or a U-shaped coil conductor as an element of a plurality of coils is formed so that adjacent coil conductors are connected with each other via through holes formed in each sheet and filled with a conductive material to form a stack of coil sheets;
superposing first and second lamination sheets without coil conductors on respective top and bottom portions of said stack of coil sheets,
superposing first and second conductor sheets as terminal electrodes respectively on an upper and a bottom portions of the respective first and second lamination sheets each having a through hole filled with the conductive material of a leading portion of an individual coil conductor;
press-fitting said conductor sheets, said first and second lamination sheets and said plurality of sheets;
thereafter, cutting said press-fitted sheets into respective chip coils, and
burning said coils to obtain the multilayer electronic part having the terminal electrodes comprised of a conductive layer structure member of the conductive sheets at opposite end portions.

### Claim 2 (depends on 1)

The method for producing a multilayer electronic part according to claim 1, wherein said step of superposing first and second conductor sheets is performed simultaneously.

### Claim 3 (depends on 1)

The method for producing a multilayer electronic part according to claim 1, further comprising:
superposing first and second plating sheets on outer portions of said first and second conductor sheets.