US 6,566,731 B2 · Open pattern inductor

Abstract

The invention includes a stacked open pattern inductor fabricated above a semiconductor substrate. The stacked open pattern inductor includes a plurality of parallel open conducting patterns embedded in a magnetic oxide or in an insulator and a magnetic material. Embedding the stacked open pattern inductor in a magnetic oxide or in an insulator and a magnetic material increases the inductance of the inductor and allows the magnetic flux to be confined to the area of the inductor. A layer of magnetic material may be located above the inductor and below the inductor to confine electronic noise generated in the stacked open pattern inductor to the area occupied by the inductor. The stacked open pattern inductor may be fabricated using conventional integrated circuit manufacturing processes, and the inductor may be used in connection with computer systems.

Claims57

Dependent claims

An inductor comprising:

an open conductive pattern formed from a first conductive material;
an insulator layer formed above and adjacent the open conductive pattern;
a magnetic oxide layer formed above and adjacent the insulator layer and having a contact site located above the open conductive pattern;
a second insulator layer formed above and adjacent the magnetic oxide layer;
a second open conductive pattern located above and adjacent the second insulator layer, the second open conductive pattern formed from a second conductive material;
and
a conductive segment to interconnect the open conductive pattern with the second open conductive pattern at the contact site.

4 more elements

Dependencies are inferred from the claim text.

Open pattern inductor

Life of this patent

Open pattern inductor

Life of this patent

Abstract

Claims57