Method for machining work by laser beam
AssigneeSeiko Epson Corporation
InventorsKazushige Umetsu, Jun Amako, Shinichi Yotsuya, Katsuji Arakawa
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Abstract
A method for processing a work in which a processed hole with a high aspect ratio is formed by laser machining. Silicon oxide films (2) are formed as protective films on front and rear surfaces, respectively, of a silicon substrate (1). The silicon substrate (1) is irradiated with a laser light through the protective films (2) to thereby perform a perforating process. Alternatively, the silicon substrate (1) is irradiated with a circularly or randomly polarized laser light. Hence, a processed hole with a high aspect ratio can be obtained. Moreover, the processed hole can be shaped straightly, so that processing accuracy is improved.
Claims17
A method of producing a semiconductor chip, comprising the steps of:
- forming a prehole in a crystalline substrate by irradiation of a laser beam split by a phase grating;
- enlarging said prehole by anisotropic etching to thereby form a through-hole;
- forming an electrically insulating film on an inner wall of said through-hole;
- and
- forming an electrically conducting material in said through-hole having said electrically insulated inner wall to thereby form a metal bump for electrically connecting one surface of said crystalline substrate to the other surface of said crystalline substrate.
A method of producing a semiconductor chip, comprising the steps of:
- forming a prehole in a crystalline substrate by laser irradiation of a laser beam circularly polarized or randomly polarized;
- enlarging said prehole by anisotropic etching to thereby form a through-hole;
- forming an electrically insulating film on an inner wall of said through-hole;
- and
- forming an electrically conducting material in said through-hole having said electrically insulated inner wall to thereby form a metal bump for electrically connecting one surface of said crystalline substrate to the other surface of said crystalline substrate.
Dependencies are inferred from the claim text.