Liquid potting composition
AssigneeSumitomo Bakelite Co., Ltd.
InventorYushi Sakamoto
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Abstract
A liquid potting composition, a semiconductor device manufactured using such composition and a process for manufacturing a semiconductor device using such composition. The liquid potting composition comprises: (a) a liquid epoxy resin; (b) a hardener comprising a multi-hydroxy aromatic compound containing at least two hydroxy groups and at least one carboxyl group; and (c) an accelerator. Suitable hardening agents include 2,3-dihydroxybenzoic acid; 2,4-dihydroxybenzoic acid; 2,5-dihydroxybenzoic acid; 3,4-dihydroxybenzoic acid; gallic acid; 1,4-dihydroxy-2-naphthoic acid; 3,5-dihydroxy-2-naphthoic acid; phenolphthaline; diphenolic acid and mixtures thereof.
Claims17
A liquid potting composition comprising:
- (1) a liquid epoxy resin;
- (2) a hardener comprising a multi-hydroxy aromatic compound containing at least two hydroxyl groups and at least one carboxyl group;
- and
- (3) an accelerator,
- wherein the viscosity of the composition, as measured at 25° C. is less than 100 Pa·s.
A liquid potting composition comprising:
- (1) a liquid epoxy resin;
- (2) a hardener comprising a multi-hydroxy aromatic compound containing at least two hydroxyl groups and at least one carboxyl group;
- and
- (3) an accelerator,
- wherein the viscosity of the composition, as measured at 25° C., is less than 70 Pa·s.
Dependencies are inferred from the claim text.