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US 6,559,956 B2Granted
Butted sensor array with supplemental chip in abutment region
AssigneeXerox Corporation
InventorDouglas E. Proctor
Life of this patent
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Abstract
The present invention relates to photosensitive chips for creating electrical signals from an original image, as would be found for example in a digital scanner, copier, facsimile machine, or other document generating or reproducing device. More specifically, the present invention relates to preferably providing a supplemental chip in each abutment region to enhance image quality.
Claims10
An assembly comprising:
- a substrate;
- a plurality of butted photosensitive chips mounted to the substrate along an array direction, wherein each photosensitive chip has an array of photosites including an edge photosite and wherein an abutment region is formed between the edge photosites of butted photosensitive chips and the butted photosensitive chips are not attached to each other;
- and
- at least one supplemental photosensitive chip mounted to the substrate and including a photosite located to receive light directed generally at the abutment region along a process direction perpendicular to the array direction.
1 more element
Dependencies are inferred from the claim text.