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US 6,559,379 B2Granted
Pressure sensor with transducer mounted on a metal base
AssigneeNovaSensor
InventorsDinesh Solanki, Janusz Bryzek
Life of this patent
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Abstract
A three piece housing, designed to house semiconductor chips is molded using a polymer material. The chip sits on a metal base. Electrical leads pass through a molded housing to provide electrical contact between the semiconductor chip and external circuitry.
Claims31
A pressure transducer package for housing a pressure transducer comprising:
- a metal lead having a downset portion, and a widened end portion upon which said pressure transducer is secured;
- and
- a plurality of polymeric walls forming a chamber, said metal lead extending through one of said walls such that said widened end portion is contained in said chamber wherein said downset portion is supported by a bottom polymeric wall.
A pressure transducer package for housing a pressure transducer comprising:
- a metal lead having a downset portion, and a base portion upon which said pressure transducer is secured;
- and
- a plurality of polymeric walls forming a chamber, said metal lead extending through one of said walls such that said base portion is contained in said chamber wherein said downset portion is encapsulated by a polymeric wall.
Dependencies are inferred from the claim text.