Method and apparatus for separating wafers
AssigneeAutomation Technology, Inc.
InventorDavid S. Gibbel
Life of this patent
Estimating the term…
Abstract
Wafers are separated individually from a stack by directing multiple jets of fluid between an outermost wafer in the stack and an adjacent wafer. The jets have sufficient pressure and are sufficiently spaced apart around the wafer stack to cause the outermost wafer to separate longitudinally from the adjacent wafer without lateral movement there between. In the illustrated embodiment, a chuck is attached to a planar surface of the outermost wafer. The attached wafer and wafer stack, once separated by the jet of fluid, are moved relatively apart, such as by movement of the chuck. The wafers in the stack are thereby separated without contact between a wafer edge and a solid object (such as a container wall or hand), minimizing the risk of wafer breakage.
Claims20
A method for individually separating wafers from a stack of wafers, the method comprising:
- directing multiple jets of fluid between an outermost wafer in the stack and an adjacent wafer, the jets being at sufficient pressure and at sufficiently spaced-apart locations around the wafer stack to cause the outermost wafer to separate longitudinally from the adjacent wafer without lateral movement there between;
- attaching to a planar surface of the outermost wafer;
- and
- moving the attached outermost wafer and wafer stack relatively apart,
- thereby separating the wafers in the stacking without contact between a solid object and a wafer edge.
A method for individually separating wafers from a stack of wafers, the method comprising:
- directing multiple jets of a fluid between an outermost wafer in the stack and an adjacent wafer in a same plane substantially parallel to a planar surface of the outermost wafer, the jets being at sufficient pressure and at sufficiently spaced-apart locations around the wafer stack to cause the outermost wafer to separate longitudinally from the adjacent wafer without lateral movement there between;
- attaching to a planar surface of the outermost wafer;
- lifting the attached outermost wafer longitudinally from the wafer stack;
- moving the lifted and attached outermost wafer laterally from the wafer stack;
- and
- releasing the attached outermost wafer apart from the stack,
- thereby separating the wafers in the stack without contact between a solid object and a wafer edge.
An apparatus for separating wafers from a stack of wafers, comprising:
- a base;
- a plurality of nozzles connected to the base and adapted to direct multiple jets of fluid between a outermost wafer in the stack and an adjacent wafer, the jets being at sufficient pressure and at sufficiently spaced-apart locations around the wafer stack to cause the outermost wafer to separate longitudinally from the adjacent wafer without significant lateral movement there between;
- and
- a chuck attached to the base and adapted to attach to a planar surface of the outermost wafer.
A de-stacking mechanism for individually separating wafers from a stack of wafers, comprising:
- a first apparatus including:
- a base;
- a plurality of nozzles attached to the base and adapted to each direct a jet of fluid between an outermost wafer in the stack and an adjacent wafer at sufficient pressure and at sufficiently spaced-apart locations around the wafer stack to cause the outermost wafer to separate longitudinally from the adjacent wafer without significant lateral movement there between;
- and
- a chuck attached to the base and adapted to attach to a planar surface of the outermost wafer;
- a second apparatus including:
- a base;
- a plurality of nozzles attached to the base and adapted to each direct a jet of fluid between an outermost wafer in the stack and an adjacent wafer at sufficient pressure and at sufficiently spaced-apart locations around the wafer stack to cause the outermost wafer to separate longitudinally from the adjacent wafer without lateral movement there between;
- and
- a chuck attached to the base and adapted to attach to a planar surface of the outermost wafer;
- and
- a supported member adapted to support the first apparatus and the second apparatus over a wafer stack.
Dependencies are inferred from the claim text.