Small format optical subassembly

A device comprising:

• a non-electrically conductive substrate having a first surface and a second surface, the first surface separated from the second surface by a thickness of the non-electrically conductive substrate, the first surface having a first region, a second region, and a third region, the first region having a first through-hole extending through the thickness, the second region having a second through-hole extending through the thickness, the first region being separated from the third region by the second region;
• an electrically conductive plating substantially covering both the first region and the third region of the first surface;
• an electrically conductive material substantially filling the first through-hole so as to form a first electrically conductive via, and the electrically conductive material substantially filling the second through-hole so as to form a second electrically conductive via, and the electrically conductive plating substantially covering the first region being electrically connected to the electrically conductive material substantially filling the first through-hole;
• an edge emitting optical diode having a first lead and a second lead, the first lead of the edge emitting optical diode electrically connected to the electrically conductive plating of the first region, the first lead of the edge emitting optical diode electrically connected to the first electrically conductive via, the second lead of the edge emitting optical diode electrically connected to the second electrically conductive via, the edge emitting optical diode having a first optical axis, and the edge emitting diode being capable of emitting an optical signal along the first optical axis;
• a reflecting mirror mounted to the non-electrically conductive substrate, the reflecting mirror having a reflective surface;
• an electrically conductive can having a first aperture and a second aperture;
• and
• a transparent element mounted on and sealed to the first aperture of the electrically conductive can, and wherein
• the second aperture of the electrically conductive can is mounted on and sealed to the electrically conductive plating adhered to the third region of the non-electrically conductive substrate so as to seal the edge emitting optical diode and the reflecting mirror from an ambient atmosphere, and wherein
• the reflective surface of the reflecting mirror intersects the first optical axis of the edge emitting optical diode so as to reflect the optical signal of the edge emitting optical diode from the first optical axis to a second optical axis, and wherein
• the second optical axis passes through the transparent element.

A device comprising:

• a non-electrically conductive substrate having a first surface and a second surface, the first surface separated from the second surface by a thickness of the non-electrically conductive substrate, the first surface having a first region, a second region, and a third region, the first region having a first through-hole extending through the thickness, the second region having a second through-hole extending through the thickness, the first region being separated from the third region by the second region;
• an electrically conductive plating substantially covering both the first region and the third region of the first surface;
• an electrically conductive material substantially filling the first through-hole so as to form a first electrically conductive via, the electrically conductive material substantially filling the second through-hole so as to form a second electrically conductive via, and the electrically conductive plating substantially covering the first region being electrically connected to the electrically conductive material substantially filling the first through-hole;
• an edge emitting optical diode having a first lead and a second lead, the first lead of the edge emitting optical diode electrically connected to the electrically conductive plating of the first region, the first lead of the edge emitting optical diode electrically connected to the first electrically conductive via, the second lead of the edge emitting optical diode electrically connected to the second electrically conductive via;
• a reflecting mirror mounted to the non-electrically conductive substrate;
• an electrically conductive can having a first aperture and a second aperture;
• and
• a transparent element mounted on and hermetically sealed to the first aperture of the electrically conductive can, and wherein
• the second aperture of the electrically conductive can is mounted on and sealed to the electrically conductive plating adhered to the third region of the non-electrically conductive substrate so as to hermetically seal the edge emitting optical diode and the reflecting mirror from an ambient atmosphere.

A device comprising:

• a non-electrically conductive substrate having a first region and a second region, the first region having a first through-hole, and the first region having a second through-hole;
• an electrically conductive plating substantially covering the second region;
• an electrically conductive material substantially filling the first through-hole so as to form a first electrically conductive via, and the electrically conductive material substantially filling the second through-hole so as to form a second electrically conductive via;
• an edge emitting optical diode having a first lead and a second lead, the first lead of the edge emitting optical diode electrically connected to the first electrically conductive via, and the second lead of the edge emitting optical diode electrically connected to the second electrically conductive via;
• a reflecting mirror mounted to the non-electrically conductive substrate;
• an electrically conductive can having a first aperture and a second aperture;
• and
• a transparent element mounted on and hermetically sealed to the first aperture of the electrically conductive can, and wherein
• the second aperture of the electrically conductive can is mounted on and sealed to the electrically conductive plating adhered to the second region of the non-electrically conductive substrate so as to hermetically seal the optical diode and the reflecting mirror from an ambient atmosphere.