Electronic circuit housing with trench vias and method of fabrication therefor

An integrated circuit package comprising:

• a first layer having one or more cavities within which one or more capacitors are embedded, wherein a non-conductive material is deposited in the one or more cavities over the one or more capacitors, and the first layer is oriented along a horizontal plane;
• and
• one or more trench vias located in the non-conductive material substantially over the one or more capacitors so that a height of each trench via extends from a top surface of the first layer to a top surface of a capacitor, and each trench via makes electrical contact with one or more terminals of the one or more capacitors, wherein each of the one or more trench vias is formed from a conductive material, and each of the one or more trench vias has a roughly rectangular shape, in the horizontal plane, with a length that is at least twice a width of each of the one or more trench vias.

A method for fabricating an electronic circuit housing, the method comprising:

• fabricating one or more layers of the electronic circuit housing, wherein the one or more layers are oriented along a horizontal plane,
• embedding one or more discrete devices within one or more cavities in at least one of the one or more layers, wherein a non-conductive material is deposited in each cavity over each discrete device, and
• forming one or more trench vias in the non-conductive material substantially over the one or more discrete devices so that a height of each trench via extends from a top surface of the at least one of the one or more layers to a top surface of at least one of the discrete devices, and each trench via makes electrical contact with one or more terminals of the discrete devices, wherein each of the one or more trench vias is formed from a conductive material, and each of the one or more trench vias has a roughly rectangular shape, in the horizontal plane, with a length that is at least twice a width of each of the one or more trench vias.