Apparatus and method for cooling a wearable electronic device

A system for cooling an electronic device containing a heat-generating component, the system comprising:

• a surface thermally coupled to the heat-generating component to be heated by the component;
• a fabric material positioned proximate the surface, the fabric material including a plurality of fibers having heat conductive properties;
• the fabric material configured for engaging the heated surface and the fabric material being pressed onto the surface for forming conductive contact between the heat conductive fibers and the surface such that the heat conductive fibers of the fabric material are operable for conducting heat away from the surface to cool the component and the electronic device.

A system for cooling an electronic device containing a heat-generating component, the system comprising:

• a surface thermally coupled to the heat-generating component to be heated by the component;
• a fabric material positioned proximate the surface, the fabric material including a plurality of fibers having heat conductive properties;
• the fabric material configured for engaging the heated surface and at least one of the heat conductive fibers and the surface having magnetic properties such that the surface and heat conductive fibers are magnetically attracted to each other so the heat conductive fibers of the fabric material conduct heat away from the surface to cool the component and the electronic device.

A method for cooling an electronic device containing a heat-generating component, the method comprising:

• providing an exposed surface having a three-dimensional topography which is thermally coupled to the heat-generating component to be heated by the component;
• positioning a fabric material proximate the surface, the fabric material including a plurality of fibers having heat conductive properties;
• engaging the heated surface with the heat conductive fibers of the fabric material and conducting heat away from the surface to cool the component and the electronic device.

A method for cooling an electronic device containing a heat-generating component, the method comprising:

• providing an exposed surface which is thermally coupled to the heat-generating component to be heated by the component;
• positioning a fabric material proximate the surface, the fabric material including a plurality of fibers having heat conductive properties;
• engaging the heated surface with the heat conductive fibers of the fabric material and pressing said fabric material onto the surface for forming conductive contact between the heat conductive fibers and the surface to conduct heat away from the surface to cool the component and the electronic device.

A method for cooling an electronic device containing a heat-generating component, the method comprising:

• providing an exposed surface which is thermally coupled to the heat-generating component to be heated by the component;
• positioning a fabric material proximate the surface, the fabric material including a plurality of fibers having heat conductive properties;
• engaging the heated surface with the heat conductive fibers of the fabric material and magnetically attracting together the surface and heat conductive fibers to conduct heat away from the surface to cool the component and the electronic device.